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BeSang is a pioneer in the design, development, and delivery of unsurpassed TRUE
3-dimensional (3D) integrated circuit (IC) solutions. Our cutting edge 3D IC
technologies enable stacking multiple device layers in a vertical direction and provide
ultra low-cost and high-performance solutions to CPU, DSP, ASIC, FPGA, SoC, DRAM,
SRMA, Flash, Image Sensor and Solid State Drive applications.
BeSang has successfully developed 3D ICs and is providing high-value intellectual
properties related to its proprietary TRUE 3D ICs. BeSang has been a member of GSA
since 2007 and is a fabless semiconductor company headquartered in Beaverton,
|BeSang’s TRUE 3D IC will be an ultimate solution for continuous evolution of the
electronics industry. Otherwise, the industry soon will be matured with slow growth.
- Sang-Yun Lee, Founder & CEO of BeSang Inc.